swaging fin heat sink swaged profile heat exchangers for cooling high power electronics applications.
Swaging (bonded fin) process where a multitude of aluminum and/or copper fins are mechanically attached to dual aluminum baseplates at the same time without the use of any adhesives. The concept of increasing fin efficiency by sharing fins between two baseplates originated in the one piece hollow extrusion

The swaging process has essentially unlimited possibilities as to length, width, height, fin thickness and fin spacing of a heatsink, so fabfin is a fabricated heatsink with a height to fin spacing ratio greater than an extruded section. Fabfin can be supplied essentially of any size where a multitude of aluminum fins of varying heights and thickness are attached by a swaging process to an aluminum baseplate of variable thickness, length and width, on four standard fin spacings.

Swaging technology : The metal displacement process developed and created an interface between the fin and a monolithic base plate, which has no measurable thermal resistance. Because there is no adhesives in the interface region, the FabFin principle provides outstanding performance in even the harshest environments.

Fins are swaged by pieces of extruded aluminum heat sinks, no air gap between interface after being processed, customized length and height are available. Widely used in power convection application like mobile communication infrastructure, telephone base station, inverter, AC drive ( like adjustable speed drives, adjustable frequency drives, IGBT frequency converters ), UPS, welding machine, vehicle, medical equipment, electrical cabinet, automation, subway etc high power devices.

You win then we win together on heat sink! with very attractive price and excellent quality ! If you are looking for heatsinks which cannot be extruded for your applications, our swaged( bonded) fin heat sinks will be your smart choice.